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The different Quality Phone Screen Replacement Types
| The three most typical qualities of the iPhone X series in the phone aftermarket |
| How to choose an aftermarket screen for the iPhone X series? At present, the screen quality of the iPhone X series in the aftermarket is uneven. How to choose is a common problem. In order to solve this problem, we have selected all the existing types on the market and conducted a professional comparison test. We have obtained 3 quality grades. They are DS+, DS and DA. |
| Quality Classification of iPhone X Series LCD Screen |
| OLED DISPLAY for IPX Seires |
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It is assembly used CSOT or similar standard glass material. This quality screen uses the original screen SOFT OLED technology, assemblies are COF (Chip on Flex) which means an IC Chip that is bonded to the flex versus being adhered to the glass. This quality is the real original OLED COF packaging technology, its main feature is screen display window full size. |
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It is assembly used XL or similar standard glass material. This quality screen uses HARD OLED technology, assemblies are COG (Chip on Glass) which means an IC Chip that is bonded to the LCD glass. This quality uses the aftermarket OEM COG packaging technology. |
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It is assembly used AUO or similar standard glass material. This quality screen uses IN-CELL technology, assemblies are COG (Chip on Glass) which means an IC Chip that is bonded to the LCD glass. This quality uses the aftermarket OEM COG packaging technology. |
| -------------------New Standard for iPhone X Seires |
| What Difference Between Hard OLED and Soft OLED? |
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Hard OLED :Manufactured from glass substrate, Mature technology can be adapted to mass production. Disadvantages: Be more careful when installing, Deformation, shock, or improper installation is likely to cause failure. |
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Soft OLED :Made of flexible material, thinner than Hard OLED, Almost the same display size compared to the original. Disadvantages: High cost due to its complicated process |
| What is COF and COG? |
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COG meaning the IC chip is fused right on to the glass. COF meaning the IC Chip is bonded to the flex. Changing the Driver IC from a glass mounting to a flex mounting can save about 1 mm of vertical space on the LCD glass. |
| Due to the resulting window size gap is very small，most buyers prefer COG because of the Mature technology, and more preferential prices. |
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| -------------------New Standard for iPhone X Seires |